Publications – Technical Papers

Technical Papers Published by IEEE*

Analysis on the Effectiveness of Clock Trace Termination Methods and Trace Lengths on a Printed Circuit BoardIEEE Int’l Symposium on EMC, 1996. pp. 453-458
Analysis on the Effectiveness of Image Planes on a Printed Circuit BoardIEEE Int’l Symposium on EMC, 1996. pp. 326-331
Time and Frequency Domain Analysis for Right Angle Corners on Printed Circuit Board TracesIEEE Int’l Symposium on EMC, 1998. pp. 551-556
Right Angle Corners on Printed Circuit Board Traces, Time and Frequency Domain AnalysisEMC’99 Tokyo, pp.638-641
Analysis on Loop Area Trace Radiated Emissions from Decoupling Capacitor Placement on Printed Circuit BoardsIEEE Int’l Symposium on EMC, 1999. pp. 423-428
Analysis on the Effectiveness of the 20-H Rule Using Numerical Simulation TechniqueIEEE Int’l Symposium on EMC, 2002. pp. 328-333
Product Safety and the Heat Sink – Dilemma of Minimizing Radiated Emissions and Maximizing Thermal CoolingIEEE Int’l Symposium on EMC, 2003. pp. 134-137
Analysis on the Effectiveness of Printed Circuit Board Edge Termination Using Discrete Components Instead of Implementing the 20-H RuleIEEE Int’l Symposium on EMC, 2004. pp. 45-5
Analysis on the Effectiveness of High Speed Printed Circuit Board Edge Radiated Emissions Based on Stimulus Source LocationIEEE Int’l Symposium on EMC, 2004. pp. 326-331.
Radiated Emission Analysis from Printed Board Edges Using Multiple Stimulus Sources17th Int’l Zurich Symposium on EMC, 2006. pp. 574-577
Power and Ground Bounce Effects on Component Performance Based on Printed Circuit Board Edge Termination MethodologiesIEEE Int’l Symposium on EMC, 2007.
Radiated Emission Effects from Multiple Via Stimulation Within a Printed Circuit BoardAsia-Pacific Symposium on EMC & 19th Int’l Zurich Symposium on EMC 2008. pp. 176-179
Component Performance Associated with Power/Return Plane Bounce Using Board Edge TerminationEMC Society of Australia EMC Conference. 2010
Radiated Emission Far-Field Propagation with Multiple Ground Stitch Ground Locations Within a Printed Circuit Board2010 Asia-Pacific Int’l Symposium on EMC. pp. 297-300
How Decoupling Capacitors May Cause Radiated EMIEMC Society of Australia EMC Conference. 2011
* NOTE: The following are copyrighted by the IEEE and also available via IEEE Xplore

Journal Papers Published in IEEE Transactions on EMC*

Analysis on the Effectiveness of the 20-H Rule for Printed Circuit Board Layout to Reduce Edge-Radiated CouplingIEEE Transactions on EMC, May 2005. Vol. 47, No. 2., pps. 227-233.
Voltage and Return Plane Bounce Affecting Digital Components Using Different Printed Circuit Board Edge Termination MethodologiesIEEE Transactions on EMC, Aug 2011, Vol. 53, No. 3,
pps. 802-805
* NOTE: The following are copyrighted by the IEEE and also available via IEEE Xplore

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