| Analysis on the Effectiveness of Clock Trace Termination Methods and Trace Lengths on a Printed Circuit Board | IEEE Int’l Symposium on EMC, 1996. pp. 453-458 |
| Analysis on the Effectiveness of Image Planes on a Printed Circuit Board | IEEE Int’l Symposium on EMC, 1996. pp. 326-331 |
| Time and Frequency Domain Analysis for Right Angle Corners on Printed Circuit Board Traces | IEEE Int’l Symposium on EMC, 1998. pp. 551-556 |
| Right Angle Corners on Printed Circuit Board Traces, Time and Frequency Domain Analysis | EMC’99 Tokyo, pp.638-641 |
| Analysis on Loop Area Trace Radiated Emissions from Decoupling Capacitor Placement on Printed Circuit Boards | IEEE Int’l Symposium on EMC, 1999. pp. 423-428 |
| Analysis on the Effectiveness of the 20-H Rule Using Numerical Simulation Technique | IEEE Int’l Symposium on EMC, 2002. pp. 328-333 |
| Product Safety and the Heat Sink – Dilemma of Minimizing Radiated Emissions and Maximizing Thermal Cooling | IEEE Int’l Symposium on EMC, 2003. pp. 134-137 |
| Analysis on the Effectiveness of Printed Circuit Board Edge Termination Using Discrete Components Instead of Implementing the 20-H Rule | IEEE Int’l Symposium on EMC, 2004. pp. 45-5 |
| Analysis on the Effectiveness of High Speed Printed Circuit Board Edge Radiated Emissions Based on Stimulus Source Location | IEEE Int’l Symposium on EMC, 2004. pp. 326-331. |
| Radiated Emission Analysis from Printed Board Edges Using Multiple Stimulus Sources | 17th Int’l Zurich Symposium on EMC, 2006. pp. 574-577 |
| Power and Ground Bounce Effects on Component Performance Based on Printed Circuit Board Edge Termination Methodologies | IEEE Int’l Symposium on EMC, 2007. |
| Radiated Emission Effects from Multiple Via Stimulation Within a Printed Circuit Board | Asia-Pacific Symposium on EMC & 19th Int’l Zurich Symposium on EMC 2008. pp. 176-179 |
| Component Performance Associated with Power/Return Plane Bounce Using Board Edge Termination | EMC Society of Australia EMC Conference. 2010 |
| Radiated Emission Far-Field Propagation with Multiple Ground Stitch Ground Locations Within a Printed Circuit Board | 2010 Asia-Pacific Int’l Symposium on EMC. pp. 297-300 |
| How Decoupling Capacitors May Cause Radiated EMI | EMC Society of Australia EMC Conference. 2011 |
