EMC Technical Papers

Conference Papers

Journal Papers

Commercial Magazines

Technical Papers Published by IEEE*

Analysis on the Effectiveness of Clock Trace Termination Methods and Trace Lengths on a Printed Circuit Board IEEE Int’l Symposium on EMC, 1996. pp. 453-458
Analysis on the Effectiveness of Image Planes on a Printed Circuit Board IEEE Int’l Symposium on EMC, 1996. pp. 326-331
Time and Frequency Domain Analysis for Right Angle Corners on Printed Circuit Board Traces IEEE Int’l Symposium on EMC, 1998. pp. 551-556
Right Angle Corners on Printed Circuit Board Traces, Time and Frequency Domain Analysis EMC’99 Tokyo, pp.638-641
Analysis on Loop Area Trace Radiated Emissions from Decoupling Capacitor Placement on Printed Circuit Boards IEEE Int’l Symposium on EMC, 1999. pp. 423-428
Analysis on the Effectiveness of the 20-H Rule Using Numerical Simulation Technique IEEE Int’l Symposium on EMC, 2002. pp. 328-333
Product Safety and the Heat Sink – Dilemma of Minimizing Radiated Emissions and Maximizing Thermal Cooling IEEE Int’l Symposium on EMC, 2003. pp. 134-137
Analysis on the Effectiveness of Printed Circuit Board Edge Termination Using Discrete Components Instead of Implementing the 20-H Rule IEEE Int’l Symposium on EMC, 2004. pp. 45-5
Analysis on the Effectiveness of High Speed Printed Circuit Board Edge Radiated Emissions Based on Stimulus Source Location IEEE Int’l Symposium on EMC, 2004. pp. 326-331.
Radiated Emission Analysis from Printed Board Edges Using Multiple Stimulus Sources 17th Int’l Zurich Symposium on EMC, 2006. pp. 574-577
Power and Ground Bounce Effects on Component Performance Based on Printed Circuit Board Edge Termination Methodologies IEEE Int’l Symposium on EMC, 2007.
Radiated Emission Effects from Multiple Via Stimulation Within a Printed Circuit Board Asia-Pacific Symposium on EMC & 19th Int’l Zurich Symposium on EMC 2008. pp. 176-179
Component Performance Associated with Power/Return Plane Bounce Using Board Edge Termination EMC Society of Australia EMC Conference. 2010
Radiated Emission Far-Field Propagation with Multiple Ground Stitch Ground Locations Within a Printed Circuit Board 2010 Asia-Pacific Int’l Symposium on EMC. pp. 297-300
How Decoupling Capacitors May Cause Radiated EMI EMC Society of Australia EMC Conference. 2011

* NOTE: The following are copyrighted by the IEEE and also available via IEEE Xplore

Journal Papers Published in IEEE Transactions on EMC*

Analysis on the Effectiveness of the 20-H Rule for Printed Circuit Board Layout to Reduce Edge-Radiated Coupling IEEE Transactions on EMC, May 2005. Vol. 47, No. 2., pps. 227-233.
Voltage and Return Plane Bounce Affecting Digital Components Using Different Printed Circuit Board Edge Termination Methodologies IEEE Transactions on EMC, Aug 2011, Vol. 53, No. 3,
pps. 802-805

* NOTE: The following are copyrighted by the IEEE and also available via IEEE Xplore

Articles Published in Commercial Magazines

Printed Circuit Board Suppression Concepts for EMC Compliance Interference Technology 1998, Parts 1 & 2
Decoupling Capacitors as a Cause of Radiated EMI:
An Analysis of Capacitor Placement (Complete article)
Part 1    Part 2		 Interference Technology 2000, Parts 1 & 2
Defining Who We Are InCompliance Magazine, Jan 2010
Locating RF Energy on a Printed Circuit Board InCompliance Magazine, Feb 2010
Emissions vs. Immunity – The Real Concern InCompliance Magazine, Apr 2010
Why FR-4 is Obsolete tor Tomorrow’s Technology InCompliance Magazine, Jun 2010
Compliance Engineering in the Future InCompliance Magazine, Aug 2010
Simulation versus Experience – Which is Better? InCompliance Magazine, Oct 2010
EMC versus Compliance Engineering InCompliance Magazine, Dec 2010
EMC and Functional Safety InCompliance Magazine, Apr 2011
The Need for Energy Conservation InCompliance Magazine, Jun 2011
Printed Circuit Boards of the Future InCompliance Magazine, Aug 2011
EMC and the Smart Grid InCompliance Magazine, Oct 2011
The Future as Compliance Engineers InCompliance Magazine, Dec 2011
Obsolescence of Technology InCompliance Magazine, Feb 2012
Robotics and EMC Engineering InCompliance Magazine, May 2012
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