Engineers are beginning to face new challenges related to the design of printed circuit boards (PCBs) and their integration into an enclosure, either metal or plastic. These challenges will increase in the future with higher speed components and systems. With the need to maximize functionality while at the same time shrinking the physical size of a product along with lower cost of development and production, we are discovering that signal integrity is becoming a greater concern than EMC. Although a system may radiate EMI in a broadband environment, will EMI be a concern in the future or should we enhance immunity protection against any and all electromagnetic threats that may occur?